Wizit Selected for 2025 SME Technology Innovation Development Project... Accelerating Entry into Defense, Aerospace, and HBM Sectors

원본보기 아이콘

Wizit, a specialized company in national strategic technologies and materials, parts, and equipment, announced on October 13, 2025, that it has been finally selected for the "2025 SME Technology Innovation Development Project" organized by the Ministry of SMEs and Startups.

This project aims to differentiate the performance of semiconductor and display etching equipment parts through the development of next-generation surface technology, and to lay the foundation for research on surface technologies related to defense and aerospace. A total of 650 million won will be invested, and Wizit will receive 480 million won in government funding over the next two years.

Semiconductor and display equipment parts are exposed to highly corrosive plasma environments, so they are manufactured by applying ceramic thermal spray coating, which has excellent plasma resistance and chemical durability. The selected project aims to develop a plasma spray coating material that can dramatically improve the lifespan of semiconductor and display equipment parts by mixing materials with superior plasma resistance characteristics, and to develop a spray technology that can increase density compared to existing spray coatings, thereby significantly enhancing the performance of semiconductor and display equipment parts.

In addition, the spray materials and technologies developed through this project will be used as preliminary research data for thermal barrier coating technology applicable to the defense and aerospace industries. Wizit continues to diversify its business portfolio.

Last year, the company entered the materials, parts, and equipment market for "glass substrates," which are considered next-generation semiconductor substrates. More recently, it succeeded in developing a special wear-resistant coating technology that can significantly extend the usage cycle of chemical mechanical polishing (CMP) equipment parts for high-bandwidth memory (HBM) processes, and has completed the production of prototypes.

The CMP process is a process that polishes the wafer surface chemically and mechanically to make it flat and is exposed to continuous friction and wear environments. Therefore, securing durability to extend the lifespan of CMP process equipment parts is urgently needed.

A Wizit official stated, "Through this national project, we will be able to further enhance the global competitiveness of Korea's semiconductor and display industries," and added, "Based on our industry-leading surface treatment technology, we aim to secure a leading position in the next-generation semiconductor materials, parts, and equipment market, and further accelerate the acquisition of new growth engines by advancing into the defense and aerospace industries."

© The Asia Business Daily(www.asiae.co.kr). All rights reserved.