Hanmi Semiconductor Launches "Big Die FC Bonder" for AI Semiconductors

On September 22, Hanmi Semiconductor Chairman Kwak Dongshin announced the launch of the company's new equipment for artificial intelligence (AI) semiconductors, the "Big Die FC (Flip Chip) Bonder," which will be supplied to global customers.

This new product is significant as it marks Hanmi Semiconductor's expansion from the high-bandwidth memory (HBM) market to the 2.5D packaging market for system semiconductors in the AI sector. Hanmi Semiconductor expects to increase its market share in the FC bonder segment, leveraging the technological expertise it demonstrated with its TC bonder for HBM. This is a strategic move to respond to the explosive growth of the advanced packaging market driven by surging demand for AI semiconductors.

The Hanmi Semiconductor "Big Die FC Bonder" supports large interposer packaging with dimensions of 75mm × 75mm. This enables processing of a much larger area compared to the conventional semiconductor packaging size of 20mm × 20mm, making it possible to integrate ultra-large dies and multi-chip assemblies required for next-generation AI semiconductors.

The system semiconductor industry is increasingly adopting 2.5D packaging due to the spread of chiplet technology. 2.5D packaging is an advanced packaging technology that integrates multiple chips such as GPU, CPU, and HBM onto a silicon interposer, enabling expanded bandwidth between chips, improved transmission speeds, and enhanced power efficiency.

TSMC's CoWoS (Chip on Wafer on Substrate) is a representative 2.5D packaging technology and has become a core technology in the AI semiconductor and high-performance computing (HPC) sectors. Global AI semiconductor companies such as Nvidia and AMD are actively adopting it.

Hanmi Semiconductor also plans to launch another new piece of equipment supporting 2.5D packaging, the "2.5D Big Die TC Bonder," in the first half of next year, further strengthening its competitiveness in the advanced packaging market.

Chairman Kwak Dongshin stated, "The Big Die FC Bonder will be deployed to the mass production lines of global customers immediately upon launch," and added, "With the release of this new product, we have strengthened our 2.5D packaging bonder lineup." He continued, "Now, we are able to provide a diverse range of equipment suitable for the AI era not only to memory customers but also to integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSAT) customers."

According to a report by market research firm Yole Intelligence, the advanced semiconductor packaging market is projected to grow at an average annual rate of 9.5%, from $46 billion (approximately 64 trillion won) in 2024 to $79.4 billion (approximately 110 trillion won) in 2030.

Founded in 1980, Hanmi Semiconductor is a global semiconductor equipment company with around 320 customers worldwide. It currently holds the top global market share for TC bonders used in HBM production, and since 2002, has focused on strengthening its intellectual property, filing more than 120 patents related to HBM equipment to date.

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