Hanmi Semiconductor Official Sponsor of '2025 Semicon Korea' Exhibition

Hanmi Semiconductor announced on the 19th that it will participate as an official sponsor in the '2025 SEMICON Korea Exhibition' held at COEX in Seoul.

Hanmi Semiconductor will exhibit ▲ the TC Bonder 3.0CW equipment, a 2.5D packaging bonder that attaches AI GPUs and HBM semiconductors to silicon interposers ▲ and the 7th generation new 'Micro Saw & Vision Placement 6.0 Griffin,' which holds the world's number one market share.

An official stated, "Through the rapid changes and growth of the artificial intelligence (AI) market, the global HBM market is expected to grow explosively every year," and added, "Hanmi Semiconductor is preparing to launch the TC Bonder, FLTC Bonder (fluxless type), and Hybrid Bonder ahead of the expansion of the AI market and the needs of its customers."

The 2025 SEMICON Korea Exhibition, held until the 21st at COEX Exhibition Center in Samseong-dong, Seoul, is the largest semiconductor exhibition in Korea organized by the Semiconductor Equipment and Materials International (SEMI). About 500 companies, including ASML, Applied Materials, and Tokyo Electron, are participating.

Hanmi Semiconductor plans to continue its global marketing efforts by participating as an official sponsor in SEMICON exhibitions held in Shanghai, China in March, Singapore in May, and Taipei, Taiwan in September this year.

Founded in 1980, Hanmi Semiconductor is a global company with approximately 320 customers worldwide, based on its unparalleled experience and know-how in the global semiconductor market. Since establishing its Intellectual Property Department in 2002, it has focused on protecting and strengthening intellectual property rights with a team of about 10 experts, filing over 120 patents related to HBM equipment to date. With its outstanding technology and durability, it is expected that the competitiveness of its equipment will be further enhanced.

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