"See the AI Chip That Doesn't Even Melt Butter"… DeepX Participates in 'Semiconductor Exhibition'

DeepX, a company specializing in core AI semiconductor technology, announced on the 14th that it will participate in the '2024 Semiconductor Exhibition' held at COEX in Gangnam-gu, Seoul from the 23rd to the 25th.

Visitors to the DeepX booth can directly participate in the 'Butter Heat Test' to experience DeepX's unique ultra-low power AI semiconductor technology that minimizes heat generation even during AI computation processes.

The Butter Heat Test is a demonstration that intuitively showcases DeepX's low power performance. Visitors can see and touch in real time how butter, which melts at human body temperature, does not melt on the DX-M1 silicon even during AI computation processing.

Images of the DeepX booth at the '2024 Semiconductor Expo' held from the 23rd to the 25th at COEX, Gangnam-gu, Seoul
[Photo by DeepX]

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This year, DeepX has solidified its position in the AI semiconductor field by participating in major global exhibitions. Starting with the CES electronics and IT exhibition in the U.S. in January, followed by the Mobile World Congress (MWC) in Europe in February, Computex ICT exhibition in Taiwan in April, the U.S. AI Hardware Summit in September, and Embedded World in the U.S. in October, DeepX has demonstrated its presence. DeepX currently provides prototypes to over 120 global companies and is developing mass production products with about 20 of these companies.

At this exhibition, in addition to these achievements, DeepX plans to showcase a real-time demonstration of the latest Vision Language Model (VLM) running on the DX-M1 M.2 module. This model features real-time detection and warning functions for risk factors such as electric vehicle fires and crowd congestion.

DeepX will also present technology that runs AI algorithms for object recognition on over 100 channels in real time using the server-grade DX-H1 PCIe module, and will propose solutions applicable to various industries in collaboration with HP and K2S.

With 297 patent applications and 71 patent registrations, DeepX has been recognized for its technological capabilities, including receiving the CES Innovation Award. Through this exhibition, DeepX plans to widely promote the differentiated performance of its low-power AI semiconductor technology both domestically and internationally.

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