[Concall] SK Hynix "Priority on Securing HBM Capacity... General DRAM Capacity Limited"

On the 25th, SK Hynix stated in its Q1 earnings conference call that it is prioritizing securing capacity for high-bandwidth memory (HBM), which has high demand visibility.

They added, "HBM has a die size approximately twice that of general DRAM, so it requires more wafer capacity," and "there will be constraints on wafer capacity used for general DRAM this year."

SK Hynix HBM3E.
Photo by SK Hynix
Image source: Yonhap News Agency

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