US Intel "1.8nm Process Starts This Year... MS Chip Production"

U.S. semiconductor company Intel will begin mass production of the 1.8㎚ (1㎚ = one billionth of a meter) process (18A) from the end of this year. Microsoft (MS) plans to produce its own artificial intelligence (AI) chips using this process.

On the 21st (local time), Intel held the 'IFS (Intel Foundry Services) Direct Connect' event at the McEnery Convention Center in San Jose, California, announcing that the mass production timeline for the 1.8㎚ process, originally planned for 2025, has been moved up to the end of this year. Although the specific types of chips to be produced with this process were not disclosed, they are presumed to be the AI chip called ‘Myia’ announced by MS last year.

Pat Gelsinger, Intel CEO, at the 'IFS (Intel Foundry Service) Direct Connect' event
Photo by Yonhap News

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Currently, TSMC and Samsung Electronics, which can mass-produce foundry (semiconductor contract manufacturing) processes below 5㎚, are targeting mass production of 2㎚-class processes next year. If Intel’s plan proceeds as scheduled, it will surpass Samsung Electronics and TSMC. Although Intel is a latecomer in the foundry business, it surprised the industry last September by unveiling a prototype semiconductor wafer using the 1.8㎚-class 18A process, putting pressure on Samsung Electronics and TSMC.

On this day, Intel also announced plans to introduce the 1.4㎚ process by 2027. Samsung Electronics and TSMC are also aiming to commercialize the 1.4㎚ process by 2027, indicating fierce competition ahead. The smaller the number preceding '㎚,' the less power the semiconductor consumes while delivering better performance. Considering that the current cutting-edge 3㎚ process improves power efficiency by 30% and speed by 20% compared to the 4㎚ process, the 1.4㎚ process is expected to be a 'game changer' that will dramatically enhance AI semiconductor performance.

Satya Nadella, CEO of MS, said in a pre-recorded video, "A stable supply of semiconductors with the best performance and quality is necessary," adding, "I am very excited to be working with Intel." Pat Gelsinger, CEO of Intel, expressed confidence, saying, "Only a very few companies worldwide possess this level of technology," and "Intel’s 18A chips will surpass TSMC’s processing speed."

There were also remarks targeting Samsung Electronics. CEO Gelsinger reaffirmed, "Intel aims to become the world’s second-largest semiconductor foundry company by 2030." Intel had previously stated its goal to catch up with Samsung Electronics, currently the second-largest foundry company, based on mass production of processes below 2㎚.

At the event, Rene Haas, CEO of ARM, also took the stage. Intel has formed a partnership with ARM to provide cutting-edge foundry services for ARM-based system-on-chip (SoC) designs.

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