Published 21 Apr.2023 20:47(KST)
Updated 22 Apr.2023 13:24(KST)
Display process equipment company Top Engineering announced on the 21st that it has developed a vertical-type micro LED non-contact inspection equipment.
The inspection equipment developed by Top Engineering simultaneously inspects thousands of micro LED chips after the wafer etching process and detects defective chips. It non-contactly inspects the electrical-optical defects of vertical-type micro LED chips, where electrodes are arranged in a vertical structure.
Following the horizontal-type micro LED non-contact inspection equipment with a size of 30 micrometers (㎛) developed last year, Top Engineering explained that the newly developed vertical-type micro LED non-contact inspection equipment can detect defects in LED chips as small as 10 micrometers (㎛).
Top Engineering's inspection equipment can detect specific fine defects that existing automated optical inspection (AOI) and photoluminescence spectroscopy (PL) inspection technologies could not detect.
Top Engineering is the first to create vertical-type micro LED inspection equipment applying an electrical-optical measurement method without direct contact with micro LED chips, following the horizontal-type micro LED inspection equipment. Vertical-type micro LED chips can be applied to micro displays such as smartwatches.
Top Engineering participated in the display exhibition "2023 Touch Taiwan," held in Taiwan for three days starting from the 19th. The company introduced the newly developed technology at the "Micro & Mini LED Display Conference."
A company official said, "Through the advancement of equipment inspection performance, we are also developing technology that can inspect micro LED chips smaller than 5 micrometers in size in the future."
The inspection equipment selects defective chips before the transfer process, which moves micro LED chips onto panels, thereby preventing defective pixel occurrence. This can reduce the cost and time of the micro LED defective pixel repair process.
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