Samsung Electro-Mechanics Unveils Semiconductor Substrate (FC-BGA) for Autonomous Driving

[Asia Economy Reporter Kim Pyeonghwa] Samsung Electro-Mechanics announced on the 26th that it has developed an automotive semiconductor substrate (FC-BGA) applicable to advanced driver assistance systems (ADAS). The company plans to expand its lineup of high-end automotive semiconductor substrates in the future.

The newly developed FC-BGA is a substrate applicable to high-performance autonomous driving systems. It belongs to the category of automotive products with high technical difficulty. Samsung Electro-Mechanics newly applied fine circuit technology accumulated from high-end IT products such as servers to automotive use, reducing the circuit line width and spacing by 20% each compared to existing substrates (for partial autonomous driving stages). More than 10,000 bumps were implemented within the limited space the size of a passport photo.

This new product also secured product reliability such as improved bending strength due to substrate enlargement and increased layers to support multi-chip packages. A multi-chip package refers to mounting multiple semiconductor chips on a single substrate at once to enhance semiconductor performance. It also obtained AEC-Q100 certification, the reliability test standard for automotive electronic components, making it applicable not only to autonomous driving but also to all fields including automotive body, chassis, and infotainment.

Sample photo of Samsung Electro-Mechanics automotive semiconductor substrate (FCBGA) / Photo by Samsung Electro-Mechanics

원본보기 아이콘

Samsung Electro-Mechanics will supply this product to global customers and target the automotive market to leap to the global No. 1 position in the high-end automotive semiconductor substrate sector. Kim Eungsoo, Vice President and Head of the Package Solution Division at Samsung Electro-Mechanics, said, “As the demand for high-spec and high-performance semiconductors continues, FC-BGA is becoming the core of semiconductor performance differentiation,” adding, “Based on FC-BGA technology, we will continuously discover core manufacturing technologies, enhance quality competitiveness, and expand production capacity to increase the market share of automotive FC-BGA.”

Samsung Electro-Mechanics started its package substrate business in 1991 and has been leading the substrate industry by supplying products to world-renowned companies. It holds the No. 1 market share in the flagship mobile AP semiconductor package substrate market. Last year, it also developed the server FC-BGA, the most technically challenging semiconductor substrate, for the first time in Korea. Recently, it established a dedicated automotive organization in major business divisions to increase the proportion of automotive products in its core business.

© The Asia Business Daily(www.asiae.co.kr). All rights reserved.