Chairman Lee Jae-yong Attends Busan Smart Factory and Samsung Electro-Mechanics New Product Shipment Ceremony

Samsung Electronics Chairman Lee Jae-yong is seen inspecting the MLCC raw material manufacturing site at Samsung Electro-Mechanics' Busan plant on the 8th.

원본보기 아이콘

[Asia Economy Reporter Park Sun-mi] Samsung Electronics Chairman Lee Jae-yong visited Busan on the 8th to attend the manufacturing site of a small and medium-sized enterprise (SME) that received support for building a smart factory, as well as the shipment ceremony for new products at Samsung Electro-Mechanics.

Samsung Electronics announced that following Chairman Lee's visit to a partner company in the Gwangju area on the 27th of last month as his first on-site management destination after taking office, this time he visited 'Donga Plating,' a Busan-based SME that received smart factory construction support from Samsung Electronics.

Chairman Lee toured the production site of Donga Plating, a plating company, emphasizing the need to "create a healthy ecosystem to achieve a virtuous cycle of coexistence." The smart factory construction support project is one of Samsung's representative CSR programs. It is evaluated as contributing to the development of Korea's manufacturing industry and win-win cooperation by providing Samsung's manufacturing innovation technology and successful know-how to strengthen the competitiveness of small and medium-sized enterprises and mid-sized companies.

Donga Plating is a small and medium-sized enterprise specializing in electro-galvanized surface treatment and has received smart factory construction support from Samsung Electronics three times since 2018. Through manufacturing innovation such as automating existing manual processes, productivity increased by 37%, and the defect rate decreased by 77%. In 2019, it received an award as an excellent smart factory company selected by the Ministry of SMEs and Startups and was recognized as an excellent case of win-win cooperation with Samsung Electronics.

On the 8th, Lee Jae-yong, Chairman of Samsung Electronics, visited 'Donga Plating,' a small and medium-sized enterprise located in Busan that received support from Samsung Electronics for building a smart factory, and toured the manufacturing site.

원본보기 아이콘

The working environment has also been greatly improved, breaking the prejudice that "plating is a tough 3D job" and transforming it into a manufacturing site sought after by young people. The average age of employees is only 32, making it a young organization.

Meanwhile, Chairman Lee also attended the shipment ceremony for server semiconductor substrate FCBGA held at Samsung Electro-Mechanics' Busan plant. Samsung Electro-Mechanics is the first domestic company to start mass production of server FCBGA, a package substrate that connects high-performance, high-capacity semiconductor chips and mainboards, requiring top-level technology. Until now, overseas companies such as those in Japan have dominated the market.

Samsung Electro-Mechanics' server FCBGA features more than 60,000 terminals finer than the thickness of a hair on a substrate the size of a business card, and with EPS (Embedded Passive Components) technology that embeds passive components in a substrate thinner than 1mm, it can reduce power consumption by 50%. The global semiconductor package substrate market is growing in demand centered on high-performance industrial and automotive high-end substrate products such as 5G, artificial intelligence (AI), and cloud, and is expected to reach $16.5 billion by 2027.

© The Asia Business Daily(www.asiae.co.kr). All rights reserved.