Samsung Electro-Mechanics and LG Innotek to Showcase Next-Generation Substrate Technologies at 'KPCA Show 2025'

Held at Songdo Convensia, Incheon, from September 3 to 5
Sharing the Latest Trends in PCB and Semiconductor Packaging Technologies

Samsung Electro-Mechanics and LG Innotek are participating in the "International Printed Circuit Board (PCB) and Semiconductor Packaging Industry Exhibition (KPCA Show 2025)," held at Songdo Convensia in Incheon from September 3 to 5, where they are showcasing next-generation substrate technologies and products.

KPCA Show 2025 Samsung Electro-Mechanics Exhibition Booth. Photo by Samsung Electro-Mechanics

This year marks the 22nd edition of the exhibition, with over 240 domestic and international companies sharing the latest trends in PCB and semiconductor packaging technologies.

Samsung Electro-Mechanics is operating its booth with two themes: the Advanced Package Substrate Zone and the Artificial Intelligence (AI) & Automotive Package Substrate Zone. In the Advanced Package Substrate Zone, the company is presenting its core high-end AI and server FCBGA (Flip Chip Ball Grid Array) technologies currently in mass production. These substrates feature an area more than ten times larger and an internal layer count more than three times greater compared to standard FCBGA.

The glass core package substrate, regarded as a next-generation substrate, reduces thickness by approximately 40% compared to conventional substrates and replaces the plastic core with glass, enhancing heat resistance and improving signal characteristics.

Other technologies on display include 2.1D package substrates that directly connect semiconductors without a silicon interposer, co-package substrates that integrate system-on-chip (SoC) and memory on a single substrate, flip chip chip scale packages (FCCSP) for AI smartphone application processors, high-reliability FCBGA for automotive applications, ultra-thin UTC substrates for AI laptops, and embedded substrates with built-in passive components.

LG Innotek has created a highlight zone at the front of its exhibition booth to showcase its world-first copper post technology.

Aerial view of the LG Innotek KPCA booth. Photo by LG Innotek

The copper post technology, optimized for semiconductor substrates used in smartphones, involves erecting small copper pillars on the substrate and placing solder balls on top, connecting the substrate to the mainboard and enabling more circuits to be placed on the semiconductor substrate. This technology can reduce substrate size by up to about 20%, and by using copper, which has more than seven times the thermal conductivity of lead, it improves heat dissipation.

In addition, LG Innotek is unveiling, for the first time, its core FC-BGA technologies such as multi-layer core substrate (MLC) technology and glass substrate technology, along with a large-area FC-BGA sample for AI and data centers measuring 118mm x 115mm.

For next-generation high-value-added substrate products, the area and number of layers are increased compared to PC products, resulting in thicker substrates. To address this, LG Innotek has applied MLC technology, stacking multiple insulating layers above and below the core layer to create a multi-layer structure that prevents warping and enhances signal efficiency.

Other exhibits include mobile semiconductor substrates such as radio frequency system-in-package (RF-SiP) and flip chip chip scale package (FC-CSP), as well as display substrates like chip-on-film (COF) and 2-metal COF.