William Cho: "LG Electronics Secures Contract to Supply Cooling Solutions for Large-Scale AI Data Center in the U.S."

On September 4, LG Electronics CEO William Cho announced via his LinkedIn account that LG Electronics has secured a contract to supply cooling solutions for a large-scale data center project in the United States.

A new oil-free inverter turbo chiller equipped with a magnetic bearing compressor independently developed by LG Electronics, featuring world-class energy efficiency. Photo by LG Electronics

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In his LinkedIn post that day, CEO Cho stated, "We recently secured a large-scale data center project in the United States and will supply chillers equipped with advanced pre-cooling functions. This demonstrates LG Electronics' technological competitiveness and our ability to meet the demanding requirements of the global AI infrastructure."

This is the first time that LG Electronics has publicly disclosed a contract for an AI data center project in the United States. The announcement is especially significant as it represents a major supply case in the U.S. market, where big tech companies are actively investing in AI data center infrastructure.

LG Electronics is reportedly planning to sequentially supply cooling solutions, including chillers equipped with high-efficiency pre-cooling functions, to the contracted AI data center. The total supply volume is expected to reach several tens of billions of Korean won.

According to global consulting firm McKinsey, global data center demand is expected to increase by an average of 22% per year, reaching 171 GW by 2030-three times the current level. In the United States alone, an additional 15 GW of data center capacity is projected to be needed.

As AI technology advances and the industrial ecosystem rapidly evolves, LG Electronics is expanding its business opportunities in the AI downstream industry by supplying essential cooling solutions that are critical for the efficiency and sustainability of data centers, which are the core of the AI ecosystem.

CEO Cho commented, "The rapid expansion of AI is accelerating demand for key infrastructure such as data centers and semiconductor equipment. Even if these sectors do not directly develop AI models, they are essential for AI performance, scalability, and sustainability." He added, "LG Electronics is identifying new opportunities in two areas: data center cooling solutions and next-generation semiconductor equipment."

In this context, CEO Cho cited examples including an AI data center currently being built in Asia in collaboration with LG CNS and LG Energy Solution, as well as the supply of high-efficiency AI data center cooling solutions in the Middle East. He also mentioned the development status of a hybrid bonder for next-generation high bandwidth memory (HBM) production.

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